Closing Date: 1st August 2018

HPS Partners Pte Ltd


Principal/Senior Plating Engineer (Semiconductor MnC/Basic Up To SGD 6,500)

Salary: 4000.00

Responsibilities:

  • Develop and Transfer Electro-plating and Wet cleaning/etching technology.
  • Process development, including process/product characterization, qualification, and production pilot runs and volume ramp.
  • New product, process, and technologies introduction to ensure process robustness and manufacturability, cost effectiveness and profitable yields.
  • Work with other teams/department to plan and perform experiments.
  • Yield analysis and trouble-shooting of defect and yield issues and process excursions associated with the new process/tool

Requirement:

  • Min. Bachelor degree in Electrical & Electronics/Materials/Chemistry, or other relevant discipline with min. 5 years of working or research experience in electro-plating and wet clean/etch

The above information on this description has been designed to indicate the general nature, and level, of the work performed by this position. It is not designed to contain, or be interpreted, as a comprehensive inventory of all duties, responsibilities and qualifications required.

We invite interested candidates to write-in with CV in MS Word format to Sansan Sanryani Cahaya EA 12C6130/ R1767240. Shortlisted candidates will be contacted for a discussion.